由IC設計與製造大廠TI，所生產的低功耗藍牙晶片，遭爆含有兩個重大的安全漏洞
成功開採相關漏洞的駭客，將可入侵企業網路，掌控無線AP或散布惡意程式，目前TI已經修補了第一個漏洞，而Cisco、Meraki與Aruba也都在11/1釋出安全修補，企業用戶必續注意，盡速更新
受影響的藍牙晶片：
●For CC2640 (non-R2) and CC2650 with BLE-STACK version 2.2.1 or an earlier version are impacted, customers can update to version 2.2.2.
●For CC2640R2F, version 1.00.00.22 (BLE-STACK 3.0.0) is impacted, customers can update to SimpleLink CC2640R2F SDK version 1.30.00.25 (BLE-STACK 3.0.1) or later.
●For CC1350, version 2.20.00.38 (BLE-STACK 2.3.3) or earlier is impacted, customers can update to SimpleLink CC13x0 SDK version 2.30.00.20 (BLE-STACK 2.3.4) or later.
