1. WLCSP : Die, Repassivation, Bump : Repassivation(PI, PBO - HD MicroSystems) : Batch Process2. Structure : Bump on Bond Pad : Bump on RDL ... ... <看更多>

Check out this video of WLCSP :) Wafer-Level Packaging( WLCSP ) is the technology of packaging and testing an integrated circuit while at the ... ... <看更多>